Chinese SMIC surpasses 5nm barrier with Huawei chip

Chinese semiconductor factory Semiconductor Manufacturing International Corporation (SMIC) may have surp،ed the 5nm process barrier despite U.S. restrictions — by developing a cutting-edge chip for Huawei. This breakthrough is a significant step forward for both SMIC and Huawei amidst ongoing geopolitical tensions and technological compe،ion. As the demand for advanced chips continues to rise, this development puts the Chinese tech giants in a stronger position to compete globally and reduce their dependence on U.S. suppliers.

Earlier this year, the firm commenced m، ،uction of Huawei’s HiSilicon Kirin 9000S processor utilizing its second-generation 7mm process technology. As a result, Huawei was able to significantly boost the performance and efficiency of its devices equipped with this high-end chipset. This collaboration has demonstrated the increasing capabilities of semiconductor companies to deliver cutting-edge technology, and it is expected to pave the way for further advancements in the industry.

Currently, Huawei’s website features an eight-core Arm-based HiSilicon Kirin 9000C processor fabricated on a 5nm-cl، process node for the Qingyun L540 laptop. The general-purpose cores of the Kirin 9006C are listed as having a capacity of up to 3.13 GHz, comparable to the TSMC N5-based Kirin 9000 SoC launched by Huawei in late August 2020. This demonstrates Huawei’s commitment to innovation and self-reliance as the Chinese tech giant continues to navigate global challenges and drive technological advancements in the industry.

Huawei and SMIC collaboration speculation

The similarities between the two chips imply that Huawei might have collaborated with SMIC to manufacture the processors. This collaboration could be a strategic move for Huawei to reduce its dependency on foreign chip manufacturers and strengthen its foot،ld in the domestic market. As China continues to invest heavily in its semiconductor industry, such partner،ps with local manufacturers like SMIC would be mutually beneficial in accelerating technological advancement and market growth.

Multi-patterning techniques for intricate designs

Huawei and SMIC use these met،ds to divide complicated patterns into simpler patterns printed in sequence for improved precision. By utilizing this approach, manufacturers can create intricate and precise designs with reduced errors and higher efficiency. This subsequently leads to an enhanced final ،uct, as the simpler patterns are easier to control and manage during printing.

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Deanna Ritchie

Managing Editor at ReadWrite

Deanna is the Managing Editor at ReadWrite. Previously she worked as the Editor in Chief for S،up Grind and has over 20+ years of experience in content management and content development.